ubc Mikromechanische Ultraschallwandler aus Silizium 2005-12-13 [Electronic ed.] prv Universitätsbibliothek Chemnitz Universitätsbibliothek Chemnitz, Chemnitz Fakultät für Maschinenbau male Huoxian County, P.R. China male male male male male This paper discusses basic issues of micromachined ultrasonic transducers, including their design and fabrication. First, the acoustic fundamentals of ultrasonic transducers are introduced, and relevant simulation methods are illustrated. Following these topics, important aspects of silicon micromachining are presented. Based on this knowledge, two distinctive micromachining processes for transducer fabrication are proposed. One of them, the bulk process, has been proved to be successful, whereas for the second one, a surface process, some improvements are still needed. Besides these works, an innovative direct bonding technology is also developed. This technology constitutes the basis of the bulk process. Of course, it can also be used for the packaging of other MEMS devices. 620 Bonden Simulation Ultraschall Wandler FEM analysis Ultrasonic transducer bonding bulk micromachining capacitive transducer direct bonding micromachining surface micromachining urn:nbn:de:swb:ch1-200501754 Technische Universität Chemnitz dgg Technische Universität Chemnitz, Chemnitz Chenping Jia M. Eng 1972-05-13 aut Thomas Gessner Prof. Dr.-Ing dgs rev Prof. Dr.-Ing. Arved Huebler Prof. Dr.-Ing. rev Bernd Michel Prof. Dr.-Ing rev Hans Gatzen Prof. Dr.-Ing rev eng 2005-01-14 2005-12-12 born digital Silicon Micromachined Ultrasonic Transducers doctoral_thesis